Invention Grant
- Patent Title: Package structure including package layers and manufacturing method thereof and display panel
-
Application No.: US16176353Application Date: 2018-10-31
-
Publication No.: US10826018B2Publication Date: 2020-11-03
- Inventor: Tao Wang , Jifeng Tan
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Nath, Goldberg & Meyer
- Agent Joshua B. Goldberg
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2177d1d2
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L51/52 ; H01L51/56

Abstract:
A package structure and a manufacturing method thereof, and a display panel are provided, and the package structure comprises a package stack disposed on a substrate; and an additional layer disposed on the package stack. The package structure provided by the present disclosure results in saving of one deposition process and one mask process, thereby the manufacturing process is simplified. Moreover, a narrow bezel may be realized.
Public/Granted literature
- US20190221773A1 PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF AND DISPLAY PANEL Public/Granted day:2019-07-18
Information query
IPC分类: