A package structure of electronic modules includes two substrates and a sealing frame. The sealing frame comprises two first silicone frames, a second silicone frame and two crystalline interfaces. The sealing frame is disposed between and within the two substrates to form a space thereof. The sealing frame serves as an excellent moisture barrier of the package structure due to the intrinsic properties of silicone. Meanwhile, the silicone can withstand the corrosion of the polar solvents and/or the plasticizers. A manufacturing method of the package structure is disclosed in this invention as well.