Invention Grant
- Patent Title: Conductive module
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Application No.: US15926839Application Date: 2018-03-20
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Publication No.: US10826044B2Publication Date: 2020-11-03
- Inventor: Shigeyuki Ogasawara , Michio Ota , Hideki Inoue
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4b9cc479
- Main IPC: H01M2/20
- IPC: H01M2/20 ; H01M10/48 ; H01R13/50 ; H01R4/70 ; H01M2/10

Abstract:
The housing member includes a housing body that houses first and second conductive members, a lid body that closes an opening of a second housing chamber of the second conductive member in the housing body, a hinge body as a living hinge therebetween, and a holding mechanism that holds the lid body in the housing body at a closing position, the holding mechanism includes a first engagement holder having an inserted portion, and a second engagement holder having a claw portion.
Public/Granted literature
- US20180337386A1 CONDUCTIVE MODULE Public/Granted day:2018-11-22
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