Invention Grant
- Patent Title: Data structure for physical layer encapsulation
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Application No.: US15458531Application Date: 2017-03-14
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Publication No.: US10827045B2Publication Date: 2020-11-03
- Inventor: Alain Mourad , Sung-hee Hwang , Daniel Ansorregui , Belkacem Mouhouche , Hak-ju Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5ad18e59 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2f535a9d
- Main IPC: H04L29/08
- IPC: H04L29/08 ; H04N19/70 ; G06F16/21 ; H04H20/95 ; H04H60/73 ; H04L29/06 ; H04B1/02 ; H04N21/234 ; H04N21/236

Abstract:
Provided are a data structure including a header area, and a payload area comprising data, a method of generating the data structure, and extracting information from the data structure. At least one of the header area and the payload area includes at least one sub-area in which one or more signal fields are included. At least one signal field among the signal fields includes information for signalling presence or absence of one or more information fields located at least partly in the data structure, the one or more information fields corresponding to the one or more signal fields.
Public/Granted literature
- US20170187849A1 DATA STRUCTURE FOR PHYSICAL LAYER ENCAPSULATION Public/Granted day:2017-06-29
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