Invention Grant
- Patent Title: Managing an issue queue for fused instructions and paired instructions in a microprocessor
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Application No.: US16408445Application Date: 2019-05-09
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Publication No.: US10831501B2Publication Date: 2020-11-10
- Inventor: Michael J. Genden , Hung Q. Le , Dung Q. Nguyen , Brian W. Thompto
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Bryan Bortnick
- Main IPC: G06F9/38
- IPC: G06F9/38

Abstract:
Disclosed is a method for managing an issue queue for fused instructions and paired instructions in a microprocessor. The method includes dispatching a fused instruction to a first entry in a double issue queue; dispatching two paired instructions to a second entry in the double issue queue; issuing the fused instruction during a single cycle to an execution unit in response to determining, by the issue queue logic, that the fused instruction is ready to issue; and issuing, by the issue queue logic, the first instruction of the two paired instructions to the execution unit in response to determining, by the issue queue logic, that the first instruction of the two paired instructions is ready to issue.
Public/Granted literature
- US20190265978A1 MANAGING AN ISSUE QUEUE FOR FUSED INSTRUCTIONS AND PAIRED INSTRUCTIONS IN A MICROPROCESSOR Public/Granted day:2019-08-29
Information query