In one embodiment, an apparatus includes a module having: an array of transducers formed in thin film structure on a substrate, the array being positioned along a tape bearing surface of the module, and a heating element positioned in the thin film structure and recessed from the tape bearing surface. An apparatus, according to another embodiment, includes a module having an array of transducers formed on a substrate, the array being positioned along a tape bearing surface of the module between skiving edges thereof. A slot is formed in the substrate adjacent one of the skiving edges. A heating element is positioned in the slot.