Invention Grant
- Patent Title: Chip resistor and method for manufacturing the same
-
Application No.: US16570447Application Date: 2019-09-13
-
Publication No.: US10832837B2Publication Date: 2020-11-10
- Inventor: Takanori Shinoura , Wataru Imahashi
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@44dbc4c0 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3fd5826c com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@31667da7
- Main IPC: H01C1/142
- IPC: H01C1/142 ; H01C17/00 ; H01C17/02 ; H01C17/242

Abstract:
A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.
Public/Granted literature
- US20200005972A1 CHIP RESISTOR AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2020-01-02
Information query