Invention Grant
- Patent Title: Coil component
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Application No.: US16017088Application Date: 2018-06-25
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Publication No.: US10832857B2Publication Date: 2020-11-10
- Inventor: Dong Seob Lee , Sang Seob Kim , Young Sun Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@46c09ad
- Main IPC: H01F27/24
- IPC: H01F27/24 ; H01F27/32 ; H01F27/28 ; H01F27/29

Abstract:
A coil component includes: a body; and external electrodes disposed on an external surface of the body. The coil part may include a first coil layer and a second coil layer connected to the first coil layer, each of the first and second coil layers may include a plurality of coil patterns, the plurality of coil patterns of the first coil layer may include a first connection coil pattern physically connected to the second coil layer, the plurality of coil patterns of the second coil layer may include a second connection coil pattern physically connected to the first connection coil pattern, and an upper surface of the first connection coil pattern may come into direct contact with a lower surface of the second connection coil pattern.
Public/Granted literature
- US20190180928A1 COIL COMPONENT Public/Granted day:2019-06-13
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