Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
-
Application No.: US15375295Application Date: 2016-12-12
-
Publication No.: US10832902B2Publication Date: 2020-11-10
- Inventor: Yoshinori Ikeda , Yuki Taniguchi , Kazuyoshi Shinohara
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@332c297c com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@34c75c6a
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/67 ; B08B3/04

Abstract:
Disclosed is a substrate processing apparatus including: a holding unit that holds a substrate; a processing liquid supply unit that supplies a processing liquid to the substrate; a cup that includes a bottom portion, a tubular peripheral wall portion erected on the bottom portion, a liquid receiving portion provided above the peripheral wall portion and configured to receive the processing liquid scattered from the substrate, and a groove portion formed in a circumferential direction on an upper surface of the peripheral wall portion, and surrounds the holding unit; and a cleaning liquid supply unit that supplies a cleaning liquid to the upper surface of the peripheral wall portion.
Public/Granted literature
- US20170186601A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2017-06-29
Information query
IPC分类: