Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
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Application No.: US16275899Application Date: 2019-02-14
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Publication No.: US10832939B2Publication Date: 2020-11-10
- Inventor: Hoon-Sung Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7bda5de4
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/762 ; H01L21/84

Abstract:
A semiconductor comprises two transistors of the first conductivity type separated from two transistors of a second conductivity type by a first element isolation layer. Further, the two transistors of the first conductivity type are separated from each other by a second element isolation layer and the two transistors of the second conductivity type are separated from each other by a third element isolation layer. In example embodiments, the second and third element isolation layers are shallower than the first element isolation layer.
Public/Granted literature
- US20190318956A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2019-10-17
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