Invention Grant
- Patent Title: Fabricating tapered semiconductor devices
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Application No.: US16117258Application Date: 2018-08-30
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Publication No.: US10832971B2Publication Date: 2020-11-10
- Inventor: Rajasekhar Venigalla , Ravikumar Ramachandran , Albert Chu , Alan Thomas , Kafai Lai
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Fleit Intellectual Property Law
- Agent Thomas S. Grzesik
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L21/8238 ; H01L27/092 ; H01L21/3213 ; H01L21/308

Abstract:
A semiconductor structure and a method for fabricating the same. The semiconductor structure includes a gate cut mask having one cut window exposing one or more portions of multiple sacrificial gate structures of the at least one plurality of sacrificial gate structures. The multiple sacrificial gate structures having been formed over portions of in structures. The method comprises forming a gate cut mask a plurality of semiconductor fins and a plurality of sacrificial gate structures. The gate cut mask being formed with one cut window exposing one or more portions of multiple sacrificial gate structures of the plurality of sacrificial gate structures. At least the portion of multiple sacrificial gate structures and one or more portions of each semiconductor fin of the plurality of semiconductor fins underlying the one or more portions of one of the multiple sacrificial gate structures are removed.
Public/Granted literature
- US20200075428A1 FABRICATING TAPERED SEMICONDUCTOR DEVICES Public/Granted day:2020-03-05
Information query
IPC分类: