Invention Grant
- Patent Title: Substrate structure, packaging method and semiconductor package structure
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Application No.: US15296722Application Date: 2016-10-18
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Publication No.: US10833024B2Publication Date: 2020-11-10
- Inventor: Chang Yi Yang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/56 ; H01L25/065 ; H01L25/00 ; H01L23/544 ; H01L23/13 ; H01L25/16 ; H01L23/31 ; H01L23/00
Abstract:
A substrate structure includes a substrate body, at least one first mold area and at least one second mold area. The substrate body has a first surface and a second surface opposite to the first surface, and defines at least one first through hole extending through the substrate body. The first mold area is disposed on the first surface of the substrate body. The second mold area is disposed on the second surface of the substrate body, wherein the first mold area is in communication with the second mold area through the first through hole.
Public/Granted literature
- US20180108619A1 SUBSTRATE STRUCTURE, PACKAGING METHOD AND SEMICONDUCTOR PACKAGE STRUCTURE Public/Granted day:2018-04-19
Information query
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