Invention Grant
- Patent Title: Pad design for reliability enhancement in packages
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Application No.: US16390589Application Date: 2019-04-22
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Publication No.: US10833031B2Publication Date: 2020-11-10
- Inventor: Hsien-Wei Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/07 ; H01L23/31 ; H01L21/311 ; H01L23/498 ; H01L25/065 ; H01L21/48
Abstract:
A package includes a corner, a device die, a molding material molding the device die therein, and a plurality of bonding features. The plurality of bonding features includes a corner bonding feature at the corner, wherein the corner bonding feature is elongated. The plurality of bonding features further includes an additional bonding feature, which is non-elongated.
Public/Granted literature
- US20190259720A1 Pad Design For Reliability Enhancement in Packages Public/Granted day:2019-08-22
Information query
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