Invention Grant
- Patent Title: Multi-chip fan out package and methods of forming the same
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Application No.: US16209454Application Date: 2018-12-04
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Publication No.: US10833039B2Publication Date: 2020-11-10
- Inventor: Chen-Hua Yu , Jing-Cheng Lin , Jui-Pin Hung
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/00 ; H01L23/538 ; H01L21/683 ; H01L23/31 ; H01L21/3105 ; H01L25/065 ; H01L25/00 ; H01L23/498 ; H01L23/544 ; H01L21/78

Abstract:
A package includes a die having a conductive pad at a top surface of the die, a stud bump over and connected to the conductive pad, and a redistribution line over and connected to the stud bump. An electrical connector is over and electrically coupled to the redistribution line.
Public/Granted literature
- US20190109118A1 Multi-Chip Fan Out Package and Methods of Forming the Same Public/Granted day:2019-04-11
Information query
IPC分类: