Invention Grant
- Patent Title: LDMOS transistors and associated systems and methods
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Application No.: US16266301Application Date: 2019-02-04
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Publication No.: US10833164B2Publication Date: 2020-11-10
- Inventor: John Xia , Marco A. Zuniga , Badredin Fatemizadeh , Vijay Parthasarathy
- Applicant: Maxim Integrated Products, Inc.
- Applicant Address: US CA San Jose
- Assignee: Maxim Integrated Products, Inc.
- Current Assignee: Maxim Integrated Products, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lathrop GPM LLP
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/78 ; H01L29/10 ; H01L29/08 ; H01L29/06 ; H01L29/423 ; H01L29/40 ; H01L29/417 ; H01L29/51 ; H01L29/66

Abstract:
A lateral double-diffused metal-oxide-semiconductor field effect (LDMOS) transistor includes a silicon semiconductor structure, a dielectric layer at least partially disposed in a trench of the silicon semiconductor structure in a thickness direction, and a gate conductor embedded in the dielectric layer and extending into the trench in the thickness direction. The dielectric layer and the gate conductor are at least substantially symmetric with respect to a center axis of the trench extending in the thickness direction, as seen when the LDMOS transistor is viewed cross-sectionally in a direction orthogonal to the lateral and thickness directions.
Public/Granted literature
- US20190181237A1 LDMOS Transistors And Associated Systems And Methods Public/Granted day:2019-06-13
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