Invention Grant
- Patent Title: Fin field effect transistor (finFET) device structure and method for forming the same
-
Application No.: US16258408Application Date: 2019-01-25
-
Publication No.: US10833167B2Publication Date: 2020-11-10
- Inventor: Sai-Hooi Yeong , Chi-On Chui , Bo-Feng Young , Bo-Yu Lai , Kuan-Lun Cheng , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/08

Abstract:
A FinFET device structure is provided. The FinFET device structure includes a fin structure formed over a substrate, and a gate structure formed over the fin structure. The FinFET device structure also includes an epitaxial source/drain (S/D) structure formed over the fin structure. A top surface and a sidewall of the fin structure are surrounded by the epitaxial S/D structure. A first distance between an outer surface of the epitaxial S/D structure and the sidewall of the fin structure is no less than a second distance between the outer surface of the epitaxial S/D structure and the top surface of the fin structure.
Public/Granted literature
- US20200135883A1 FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2020-04-30
Information query
IPC分类: