Invention Grant
- Patent Title: Manufacturing method of semiconductor device
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Application No.: US15827426Application Date: 2017-11-30
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Publication No.: US10833202B2Publication Date: 2020-11-10
- Inventor: Junichi Koezuka , Shinji Ohno , Yuichi Sato , Shunpei Yamazaki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@68630ea4
- Main IPC: H01L29/36
- IPC: H01L29/36 ; H01L29/786 ; H01L29/66 ; H01L29/24 ; H01L29/49

Abstract:
A transistor using an oxide semiconductor, which has good on-state characteristics is provided. A high-performance semiconductor device including the transistor capable of high-speed response and high-speed operation is provided. The transistor includes the oxide semiconductor film including a channel formation region and low-resistance regions in which a metal element and a dopant are included. The channel formation region is positioned between the low-resistance regions in the channel length direction. In a manufacturing method of the transistor, the metal element is added by heat treatment performed in the state where the oxide semiconductor film is in contact with a film including the metal element and the dopant is added through the film including the metal element by an implantation method so that the low resistance regions in which a metal element and a dopant are included are formed.
Public/Granted literature
- US20180145180A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Public/Granted day:2018-05-24
Information query
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