Invention Grant
- Patent Title: Microelectronic devices including capacitor structures and methods of forming microelectronic devices
-
Application No.: US16215929Application Date: 2018-12-11
-
Publication No.: US10833206B2Publication Date: 2020-11-10
- Inventor: Michael A. Smith
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L29/94
- IPC: H01L29/94 ; H01L27/11526 ; H01L29/49 ; H01L21/28 ; G11C16/30 ; H01L27/11573 ; H01L29/66 ; G11C16/04

Abstract:
A semiconductor structure includes a capacitor structure comprising an active region comprising opposing field edges parallel to a first horizontal direction and a gate region comprising opposing gate edges parallel to a second horizontal direction transverse to the first horizontal direction. The semiconductor structure also comprises a first dielectric material adjacent at least one of the opposing field edges or the opposing gate edges and a second dielectric material adjacent the active area and abutting portions of the first dielectric material. A height of the second dielectric material in a vertical direction may be less than the height of the first dielectric material. Semiconductor devices and related methods are also disclosed.
Public/Granted literature
Information query
IPC分类: