Invention Grant
- Patent Title: Encapsulation method of organic light emitting diode device and encapsulation structure encapsulated using same
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Application No.: US16330092Application Date: 2019-01-18
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Publication No.: US10833290B2Publication Date: 2020-11-10
- Inventor: Ming Zhang , Hsianglun Hsu
- Applicant: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Applicant Address: CN Hubei
- Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Hubei
- Agent Mark M. Friedman
- International Application: PCT/CN2019/072379 WO 20190118
- International Announcement: WO2020/007033 WO 20200109
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/56
Abstract:
An encapsulation method of an organic light emitting diode (OLED) device is provided. The encapsulation method includes steps of a substrate formed with the OLED device; forming at least an encapsulation film on a surface of the OLED device; and bonding a pre-formed barrier layer to an edge region of the encapsulation film. By bonding the pre-formed barrier layer to the edge region of the encapsulation film, the disclosure can achieve effects of improving an ability of moisture and oxygen resistance of the edge region of the OLED device, thereby improving reliability of encapsulation of the OLED device and prolonging lifetime of the OLED device.
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