Invention Grant
- Patent Title: Radio frequency circuit board with microstrip-to-waveguide transition
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Application No.: US16381893Application Date: 2019-04-11
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Publication No.: US10833415B2Publication Date: 2020-11-10
- Inventor: John E. Rogers
- Applicant: THE BOEING COMPANY
- Applicant Address: US IL Chicago
- Assignee: THE BOEING COMPANY
- Current Assignee: THE BOEING COMPANY
- Current Assignee Address: US IL Chicago
- Agency: Armstrong Teasdale LLP
- Main IPC: H01Q13/00
- IPC: H01Q13/00 ; H01Q19/06 ; H01Q9/04 ; H01Q15/08 ; H01Q1/38 ; H01Q1/48 ; H01Q13/10

Abstract:
A radio frequency (RF) printed circuit board (PCB) including a ground plane, a microstrip transmission line, a patch antenna element, a waveguide, and a dielectric lens. The RF PCB includes a first substrate having a top surface on which the patch antenna element is disposed, the patch antenna element including a slot aperture. The microstrip transmission line is disposed between the first substrate and a second substrate, and is configured to be electromagnetically coupled to the patch antenna element through the slot aperture. The ground plane is disposed on a third substrate and is electromagnetically coupled to the microstrip transmission line. The waveguide includes an aperture attached to the top surface and encloses the patch antenna element. The waveguide is configured to be electromagnetically coupled to the patch antenna element. The dielectric lens is disposed on the patch antenna element and extends into the aperture of the waveguide.
Public/Granted literature
- US20200328521A1 RADIO FREQUENCY CIRCUIT BOARD WITH MICROSTRIP-TO-WAVEGUIDE TRANSITION Public/Granted day:2020-10-15
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