To provide a method for producing an electrically conductive bond between an electrical line, which includes a plurality of individual conductors, and an electrically conductive component, including producing from a crimp element blank a crimp element enclosing portions of the individual conductors, the crimp element including a continuous side and a discontinuous side, at which edge regions of the crimp element lie opposite one another, and substance-to-substance bonding of the crimp element with a contact surface of the component, which is simple to carry out and nevertheless always results in a robust substance-to-substance bond between the crimp element and the component, it is proposed that the crimp element be produced in such a way that the continuous side of the crimp element includes two bearing surfaces which are spaced from one another, at which the crimp element is substance-to-substance bondable to the contact surface of the component.