An electrical contact includes a main body, a supporting arm extending upwardly from an upper edge thereof, and a spring arm extending curvedly and upwardly from a lower edge thereof with a contacting region at a free end. The spring arm will contact the supporting arm when the spring arm is downwardly pressed by the CPU. A solder part is sidewardly connected to a downward extension formed on a lower portion of the main body and located beside the spring arm, and includes a vertical section extending from the side edge of the downward extension, a horizontal solder pad extending from a lower edge of the vertical direction wherein a curved joint is formed between the downward extension and the vertical section for easy adjusting the angle formed between the downward extension and the vertical section, thus being adapted to fit different CPUs and PCBs.