Invention Grant
- Patent Title: Methods of manufacturing inductor modules and power semiconductor systems having inductor modules
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Application No.: US16811853Application Date: 2020-03-06
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Publication No.: US10833583B2Publication Date: 2020-11-10
- Inventor: Petteri Palm , Frank Daeche , Zeeshan Umar , Andrew Sawle , Maciej Wojnowski , Xaver Schloegel , Josef Hoeglauer
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H02M3/155 ; H01F27/255 ; H01F17/00 ; H02M3/158 ; H01F41/04 ; H01F17/06 ; H02M1/00 ; H01F27/06
Abstract:
A method of manufacturing a power semiconductor system includes providing a power stage module having one or more power transistor dies attached to or embedded in a first printed circuit board and attaching an inductor module to the power stage module such that the inductor module is electrically connected to an output node of the power stage module. The inductor module includes a ferrite sheet embedded in a second printed circuit board and windings patterned into the second printed circuit board. Further methods of manufacturing power semiconductor systems and methods of manufacturing inductor modules are also described.
Public/Granted literature
- US20200212798A1 Methods of Manufacturing Inductor Modules and Power Semiconductor Systems Having Inductor Modules Public/Granted day:2020-07-02
Information query
