Invention Grant
- Patent Title: Integrated and distributed over temperature protection for power management switches
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Application No.: US16295447Application Date: 2019-03-07
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Publication No.: US10833668B2Publication Date: 2020-11-10
- Inventor: Chiong Yew Lai , Javier A. Salcedo
- Applicant: Analog Devices International Unlimited Company
- Applicant Address: IE Limerick
- Assignee: Analog Devices International Unlimited Company
- Current Assignee: Analog Devices International Unlimited Company
- Current Assignee Address: IE Limerick
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: H03K17/0812
- IPC: H03K17/0812 ; H03K17/08

Abstract:
A plurality of lower voltage metal oxide semiconductor sensors are integrated and distributed in various parts of a power MOSFET to provide over temperature protection. The sensors are sensitive to temperatures of the various parts of the power MOSFET and configured to regulate the power MOSFET when a trip temperature is reached by reducing the operation of the MOSFET. A bias network is configured to set the trip temperature. In some configurations, a threshold voltage is used to monitor and control the maximum temperature.
Public/Granted literature
- US20200287530A1 INTEGRATED AND DISTRIBUTED OVER TEMPERATURE PROTECTION FOR POWER MANAGEMENT SWITCHES Public/Granted day:2020-09-10
Information query
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