A glue dispensing method includes making a glue dispensing hole in a processing region. The processing region is a region that is in a surface mount region corresponding to the surface mount component and in which no electronic circuit and pad exist. The method also includes welding the surface mount component onto the circuit board. The method further includes injecting glue into the glue dispensing hole, to fill a gap between the surface mount component and the circuit board, and placing the circuit board still, to wait for curing of the glue.