Invention Grant
- Patent Title: Manufacturing method of semiconductor device and semiconductor manufacturing apparatus
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Application No.: US14843550Application Date: 2015-09-02
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Publication No.: US10850363B2Publication Date: 2020-12-01
- Inventor: Yukiteru Matsui , Takahiko Kawasaki , Akifumi Gawase , Shuji Suzuki , Tsutomu Miki
- Applicant: TOSHIBA MEMORY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Toshiba Memory Corporation
- Current Assignee: Toshiba Memory Corporation
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2015-007017 20150116
- Main IPC: B24B37/005
- IPC: B24B37/005 ; G01N29/14 ; G01N29/44 ; G01N29/46
Abstract:
In accordance with an embodiment, a manufacturing method of a semiconductor device includes detecting elastic waves, and detecting or predicting an abnormality of the processing object occurring during polishing of the processing object. The elastic waves are generated from the processing object during the polishing. The abnormality is detected or predicted by analyzing the detected elastic waves.
Public/Granted literature
- US20160207163A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS Public/Granted day:2016-07-21
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