Invention Grant
- Patent Title: Overhead payload module with integrated stowbins
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Application No.: US16134685Application Date: 2018-09-18
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Publication No.: US10850845B2Publication Date: 2020-12-01
- Inventor: Stephen M. Young , Duane M. Egging , Douglas J. Seiersen , Kyong S. Kim
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Main IPC: B64D11/00
- IPC: B64D11/00

Abstract:
In an example, an overhead payload module is described. The overhead payload module comprises a ceiling assembly, an aisle floor assembly, a first payload assembly attached to the ceiling assembly and the aisle floor assembly to form a first side of the overhead payload module, and a second payload assembly attached to the ceiling assembly and the aisle floor assembly to form a second side of the overhead payload module. The first payload assembly comprises a first payload module and a first overhead stowbin module structurally integrated with the first payload module and having a first stowage area configured to receive stowbins. The second payload assembly is positioned opposite the first payload assembly to form an aisle therebetween and comprises a second payload module and a second overhead stowbin module structurally integrated with the second payload module and having a second stowage area configured to receive stowbins.
Public/Granted literature
- US20200086991A1 Overhead Payload Module with Integrated Stowbins Public/Granted day:2020-03-19
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