Invention Grant
- Patent Title: Epoxy (meth) acrylate compound and curable composition containing same
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Application No.: US16320606Application Date: 2017-07-24
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Publication No.: US10851199B2Publication Date: 2020-12-01
- Inventor: Masahiko Toba , Jun Dou , Chika Yamashita , Yoshitaka Ishibashi , Hiroshi Uchida
- Applicant: SHOWA DENKO K. K.
- Applicant Address: JP Tokyo
- Assignee: SHOWA DENKO K. K.
- Current Assignee: SHOWA DENKO K. K.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2016-148390 20160728
- International Application: PCT/JP2017/026644 WO 20170724
- International Announcement: WO2018/021224 WO 20180201
- Main IPC: C08G59/14
- IPC: C08G59/14 ; C08G59/17 ; C08F299/02 ; C08F20/32 ; C08G59/02 ; C08G59/24 ; C08L63/10

Abstract:
An epoxy (meth)acrylate compound represented by general formula (1): where at least one of R1 to R5 has a structure represented by formula (2): * denotes the bonding position to a carbon atom that constitutes the benzene ring to which R1 to R5 are bonded in formula (1), R7 denotes a hydrogen atom or a methyl group, the remainder of R1 to R5 are each independently selected from the group consisting of hydrogen atoms, alkyl groups and alkoxy groups having 1-6 carbon atoms, and R6 denotes a hydrogen atom or a methyl group. In the epoxy (meth)acrylate compound, the content of halogen atoms is 100 ppm by mass or less. A curable composition for forming a protective film for an electrically conductive pattern obtained by mixing the epoxy (meth)acrylate compound with a photopolymerization initiator and at least one type of monomer or oligomer that contains a (meth)acryloyl group.
Public/Granted literature
- US20190153149A1 EPOXY (METH) ACRYLATE COMPOUND AND CURABLE COMPOSITION CONTAINING SAME Public/Granted day:2019-05-23
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