Invention Grant
- Patent Title: Phenolic resin composition and the use thereof in a rubber composition to reduce hysteresis
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Application No.: US16353718Application Date: 2019-03-14
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Publication No.: US10851224B2Publication Date: 2020-12-01
- Inventor: John M. Whitney , Darren C. Seel , Alexandra Krawicz , Timothy E. Banach
- Applicant: SI GROUP, INC.
- Applicant Address: US NY Schenectady
- Assignee: SI GROUP, INC.
- Current Assignee: SI GROUP, INC.
- Current Assignee Address: US NY Schenectady
- Agency: Cozen O'Connor
- Agent Jeffrey N. Townes
- Main IPC: C08L7/00
- IPC: C08L7/00 ; C08G8/28 ; C08J3/24 ; C08K5/37 ; C07C323/25 ; B60C1/00 ; C08J3/22

Abstract:
This invention relates to a phenolic resin composition comprising a phenolic resin admixed with and/or modified by one or more functionalized organosulfur compounds. This invention also relates to a rubber composition comprising (i) a natural rubber, a synthetic rubber, or a mixture thereof; (ii) one or more phenolic resins; and (iii) one or more functionalized organosulfur compounds. The interaction between the component (i) and the components (ii) and (iii) reduces the hysteresis increase compared to a rubber composition without the component (iii), upon curing the rubber composition. The invention also relates to a process for preparing the phenolic resin composition, a process for preparing the rubber composition, and a process for reducing the hysteresis increase caused in a rubber composition when a phenolic resin is added to a rubber composition.
Public/Granted literature
- US20190284370A1 PHENOLIC RESIN COMPOSITION AND THE USE THEREOF IN A RUBBER COMPOSITION TO REDUCE HYSTERESIS Public/Granted day:2019-09-19
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