Invention Grant
- Patent Title: Silver and copper nanoparticle composites
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Application No.: US15806487Application Date: 2017-11-08
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Publication No.: US10851257B2Publication Date: 2020-12-01
- Inventor: Deepak Shukla
- Applicant: Eastman Kodak Company
- Applicant Address: US NY Rochester
- Assignee: Eastman Kodak Company
- Current Assignee: Eastman Kodak Company
- Current Assignee Address: US NY Rochester
- Agent J. Lanny Tucker
- Main IPC: C09D101/28
- IPC: C09D101/28 ; C09D101/12 ; C09D5/24 ; H01B1/22 ; C09D7/40 ; C08K3/08 ; C08K9/12

Abstract:
A silver nanoparticle composite or a copper nanoparticle composite is formed in which the silver nanoparticle composite has silver nanoparticles, and both (a) one or more polymers and ascorbic acid adsorbed on the silver nanoparticles, wherein the (a) one or more polymers are selected from one or more of cellulose acetate, cellulose acetate phthalate, cellulose acetate butyrate, cellulose acetate propionate, cellulose acetate trimellitate, hydroxypropylmethyl cellulose phthalate, methyl cellulose, ethyl cellulose, hydroxyethyl cellulose, hydroxypropylmethyl cellulose, and carboxymethyl cellulose. Copper nanoparticle composite are similarly formed in which both the (a) one or more polymers and ascorbic acid are adsorbed on the copper nanoparticles.
Public/Granted literature
- US20190136081A1 SILVER AND COPPER NANOPARTICLE COMPOSITES Public/Granted day:2019-05-09
Information query
IPC分类: