Invention Grant
- Patent Title: Adhesives comprising polyindane resins
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Application No.: US15845222Application Date: 2017-12-18
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Publication No.: US10851270B2Publication Date: 2020-12-01
- Inventor: Mark William Ingratta , Soumendra Kumar Basu , Mark Stanley Pavlin , Joseph Alexander Deloach , George Joseph Kutsek , Wei Min Cheng , Terri Roxanne Carvagno , Christopher Lee Lester
- Applicant: Eastman Chemical Company
- Applicant Address: US TN Kingsport
- Assignee: Eastman Chemical Company
- Current Assignee: Eastman Chemical Company
- Current Assignee Address: US TN Kingsport
- Agent Polly C. Owen
- Main IPC: C09J125/08
- IPC: C09J125/08 ; C08L53/00 ; C08F12/34 ; C09J125/16 ; C09J165/00

Abstract:
The present invention is generally related to various types of compositions that comprise a polyindane resin. In particular, the polyindane resins may be utilized in various polymer-based and elastomer-based formulations in order to enhance several properties and characteristics of those formulations. More specifically, adhesive formulations are provided that comprise at least one polyindane resin, which may be used to replace or enhance the functionality of existing hydrocarbon resins typically used in adhesive formulations. Compositions comprising at least one thermoplastic elastomer and at least one polyindane resin are also provided.
Public/Granted literature
- US20180171189A1 ADHESIVES COMPRISING POLYINDANE RESINS Public/Granted day:2018-06-21
Information query
IPC分类: