Invention Grant
- Patent Title: Casing, electronic device, and method of fabricating casing
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Application No.: US16423195Application Date: 2019-05-28
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Publication No.: US10851970B2Publication Date: 2020-12-01
- Inventor: Yi-An Chen , Hsin-Chi Chen , Yu-Teng Chang , Ying-Chi Wu , Hsiang-Ho Lo
- Applicant: Wistron Corporation
- Applicant Address: TW New Taipei
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW New Taipei
- Agency: JCIPRNET
- Priority: TW108106373A 20190225
- Main IPC: F21V21/00
- IPC: F21V21/00 ; F21V11/08 ; B41M1/30 ; F21W111/00 ; F21Y115/10

Abstract:
A method of fabricating a casing including steps of providing a polycarbonate substrate, printing a first material on the polycarbonate substrate to form a light shielding layer by using a first screen, and printing a second material on the light shielding layer to form a light transmission layer by using a second screen is provided. The light shielding layer has at least one patterned transmissive region. The light transmission layer covers the at least one patterned transmissive region and a portion of polycarbonate substrate exposed by the at least one patterned transmissive region. Mesh counts of the first screen is greater than that of the second screen. A casing including a polycarbonate substrate, a light shielding layer, and a light transmission layer is provided. A thickness of the light transmission layer is greater than a thickness of the light shielding layer. An electronic device adopting the casing is provided.
Public/Granted literature
- US20200271302A1 CASING, ELECTRONIC DEVICE, AND METHOD OF FABRICATING CASING Public/Granted day:2020-08-27
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