Invention Grant
- Patent Title: Heat pump device
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Application No.: US16310617Application Date: 2016-08-25
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Publication No.: US10852007B2Publication Date: 2020-12-01
- Inventor: Mitsuru Kawashima
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Posz Law Group, PLC
- International Application: PCT/JP2016/074876 WO 20160825
- International Announcement: WO2018/037544 WO 20180301
- Main IPC: F24D3/18
- IPC: F24D3/18 ; F24F3/06 ; F24F11/70 ; F24F1/16 ; F24F1/18

Abstract:
A heat pump device can discharge air in a heat medium circuit regardless of the height positions of two bodies of the heat pump device and prevents refrigerant outflow when the refrigerant enters the heat medium circuit in the liquid heat exchanger. A pump causes the liquid heat medium to flow in a predetermined circulatory direction in a heat medium pipe, and a liquid heat exchanger, a first air vent valve and a second air vent valve are arranged in this order along a circulatory direction.
Public/Granted literature
- US20190331346A1 HEAT PUMP DEVICE Public/Granted day:2019-10-31
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