Invention Grant
- Patent Title: Holistic sensing method and system
-
Application No.: US16166596Application Date: 2018-10-22
-
Publication No.: US10852276B2Publication Date: 2020-12-01
- Inventor: Yasutaka Serizawa , Sudhanshu Gaur , Yusuke Shomura
- Applicant: Hitachi, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Main IPC: G01R33/00
- IPC: G01R33/00 ; H04R1/40 ; H04R3/00 ; G01N29/14

Abstract:
Systems and methods described herein are directed to a specialized Internet of Things (IoT) device deploying both acoustic and radio wave signals. In example implementations described herein, camera data and acoustic sensor data is integrated to generate an acoustic sensor heatmap for the holistic sensing systems in an IoT area.
Public/Granted literature
- US20200124572A1 HOLISTIC SENSING METHOD AND SYSTEM Public/Granted day:2020-04-23
Information query