Invention Grant
- Patent Title: Optical subassembly and optical module
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Application No.: US16456751Application Date: 2019-06-28
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Publication No.: US10852493B2Publication Date: 2020-12-01
- Inventor: Daisuke Noguchi , Hiroshi Yamamoto
- Applicant: Lumentum Japan, Inc.
- Applicant Address: JP Kanagawa
- Assignee: Lumentum Japan, Inc.
- Current Assignee: Lumentum Japan, Inc.
- Current Assignee Address: JP Kanagawa
- Agency: Harrity & Harrity, LLP
- Priority: JP2018-147077 20180803; JP2018-147078 20180803
- Main IPC: G02B6/42
- IPC: G02B6/42

Abstract:
An optical subassembly may include a device mounting substrate on which an optical device is mounted, a relay substrate including a first conductor pattern transmitting a electrical signal to the optical device, a pedestal including a third surface on which the relay substrate is placed and a fourth surface on which the device mounting substrate is placed and a spacer interposed between the third surface and the relay substrate to electrically connect the relay substrate and the pedestal. In an optical subassembly, the first lead terminal may include a small-diameter part and a large-diameter part provided at an end of the small-diameter part and having a larger diameter than that of the small-diameter part, and at least part of the large-diameter part may be exposed from the dielectric on a first surface side and the first lead terminal and the first conductor pattern may be connected by brazing and soldering.
Public/Granted literature
- US20200041735A1 OPTICAL SUBASSEMBLY AND OPTICAL MODULE Public/Granted day:2020-02-06
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