Invention Grant
- Patent Title: Adaptive power down of intra-chip interconnect
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Application No.: US16294755Application Date: 2019-03-06
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Publication No.: US10852810B2Publication Date: 2020-12-01
- Inventor: Patrick P. Lai , Robert Allen Shearer
- Applicant: Microsoft Technology Licensing, LLC
- Applicant Address: US WA Redmond
- Assignee: Microsoft Technology Licensing, LLC
- Current Assignee: Microsoft Technology Licensing, LLC
- Current Assignee Address: US WA Redmond
- Agency: Alleman Hall Creasman & Tuttle LLP
- Main IPC: G06F1/32
- IPC: G06F1/32 ; G06F1/3234 ; G11C5/14 ; G06F1/3246 ; G06F1/3203 ; G06F1/3293 ; G06F12/0897 ; G06F1/3287

Abstract:
An integrated circuit comprising a plurality of last-level caches, a plurality of processor cores configured to access data in the plurality of last-level caches, and an interconnect network. The plurality of last-level caches can be placed in at least a high cache-power consumption mode and a low cache-power consumption mode. The plurality of last-level caches includes a first last-level cache and a second last-level cache. The interconnect network comprises a plurality of links that can be placed in at least a high link-power consumption mode and a low link-power consumption mode. The interconnect network is configured to cause a first subset of the plurality of links to be placed in the low link-power consumption mode based at least in part on the first last-level cache being in the low cache-power consumption mode.
Public/Granted literature
- US20190204898A1 ADAPTIVE POWER DOWN OF INTRA-CHIP INTERCONNECT Public/Granted day:2019-07-04
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