Invention Grant
- Patent Title: Magnetic assembly structure and assembling/disassembling method using the magnetic assembly structure
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Application No.: US16153945Application Date: 2018-10-08
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Publication No.: US10854366B2Publication Date: 2020-12-01
- Inventor: Wei-Long Lee
- Applicant: TAIWAN OASIS TECHNOLOGY CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: TAIWAN OASIS TECHNOLOGY CO., LTD.
- Current Assignee: TAIWAN OASIS TECHNOLOGY CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: Jackson IPG PLLC
- Agent Demian K. Jackson
- Main IPC: H01F1/00
- IPC: H01F1/00 ; H01F7/02 ; H01F7/08

Abstract:
A magnetic assembly structure has a main body and an inserting component. A first receiving slot of the main body receives a first magnetic component, and a second receiving slot of the main body penetrates a main body surface to form a main body opening on the main body surface. An engagement slot of the main body is disposed between the first receiving slot and the second receiving slot, communicated with the second receiving slot, and has a contacting surface being away from the main body surface with a distance. The receiving slot of the inserting component receives a second magnetic component. The inserting component is inserted into the second receiving slot via the main body opening, and the second magnetic component moves into the engagement slot. The magnetic assembly is assembled with a less force, has higher safety, and is hard to be disassembled without allowance or explanations.
Public/Granted literature
- US20200111592A1 MAGNETIC ASSEMBLY STRUCTURE AND ASSEMBLING/DISASSEMBLING METHOD USING THE MAGNETIC ASSEMBLY STRUCTURE Public/Granted day:2020-04-09
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