Invention Grant
- Patent Title: Inductor device
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Application No.: US15880003Application Date: 2018-01-25
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Publication No.: US10854373B2Publication Date: 2020-12-01
- Inventor: Tsukasa Nakanishi , Kiyokazu Sato , Osamu Hoshino
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2017-016469 20170201
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F27/28 ; H01F41/04 ; H01F17/00 ; H01F27/29

Abstract:
An inductor device includes a resin film, a first base conductor layer formed on one surface of the resin film and having a first pad, a second base conductor layer formed on the other surface of the resin film and having a second pad, a through-hole penetrating from the first pad to the second pad, a through conductor filled in the through-hole and provided to connect the first pad and the second pad each other, a first insulating layer formed on the one surface of the resin film and having an opening arranged on the first base conductor layer, and a first conductor part formed on the first base conductor layer in the opening of the first insulating layer. A first conductor pattern layer includes the first base conductor layer and the first conductor part. The first conductor pattern layer has a convex sectional shape.
Public/Granted literature
- US20180218830A1 INDUCTOR DEVICE Public/Granted day:2018-08-02
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