Invention Grant
- Patent Title: Wiring substrate
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Application No.: US16211716Application Date: 2018-12-06
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Publication No.: US10854475B2Publication Date: 2020-12-01
- Inventor: Natsuko Kitajo
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano
- Agency: IPUSA, PLLC
- Priority: JP2017-250751 20171227
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/498

Abstract:
A wiring substrate includes: a first insulating layer; a plurality of wiring patterns formed on one surface of the first insulating layer; a dummy pattern formed, on the one surface of the first insulating layer, between the nearby wiring patterns; and a second insulating layer made of resin and formed on the one surface of the first insulating layer so as to cover the nearby wiring patterns and the dummy pattern, wherein the dummy pattern is a dot pattern arranged at a center portion between the nearby wiring patterns, and wherein a height of at least one dot constituting the dummy pattern is lower than heights of the nearby wiring patterns.
Public/Granted literature
- US20190198433A1 WIRING SUBSTRATE Public/Granted day:2019-06-27
Information query
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