Invention Grant
- Patent Title: Reaction chamber and plasma processing apparatus
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Application No.: US15119525Application Date: 2014-12-03
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Publication No.: US10854482B2Publication Date: 2020-12-01
- Inventor: Xingcun Li , Gang Wei , Dongsan Li , Changle Guan , Mingda Qiu , Longchao Zhao , Mingming Song
- Applicant: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Current Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN201410063219 20140224
- International Application: PCT/CN2014/092878 WO 20141203
- International Announcement: WO2015/124014 WO 20150827
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01J37/32

Abstract:
A reaction chamber is provided. The reaction chamber includes a chamber body, a dielectric window, and a power supplier. The dielectric window is provided on top of the chamber body along a first direction and hermetically connected with the chamber body. Each coil of a plurality of sets of coils is wound around an outer surface of the dielectric window at an interval along the first direction. The plurality of sets of coils are connected in parallel, with first ends electrically coupled to the power supplier for supplying power to each set of the plurality of sets of coils, and with second ends grounded. The second ends of the plurality of sets of coils are arranged in proximity between the first ends.
Public/Granted literature
- US20170011938A1 REACTION CHAMBER AND PLASMA PROCESSING APPARATUS Public/Granted day:2017-01-12
Information query
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