Invention Grant
- Patent Title: Wafer carrier handling apparatus and method thereof
-
Application No.: US16396426Application Date: 2019-04-26
-
Publication No.: US10854490B2Publication Date: 2020-12-01
- Inventor: Tsung-Sheng Kuo , Chih-Hung Huang , Ming-Hsien Tsai , Yang-Ann Chu , Hsuan Lee , Jiun-Rong Pai
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677 ; B65G47/91
Abstract:
A wafer carrier handling apparatus includes a housing, a platform, a moving mechanism and a door storage device. The platform is configured to hold a wafer carrier. The moving mechanism is connected to the housing and configured to move the platform with respect to the housing. The door storage device is disposed above the housing. The door storage device has a first door storage zone. The first door storage zone is configured to allow a door of the wafer carrier to be held thereon.
Public/Granted literature
- US20200058535A1 WAFER CARRIER HANDLING APPARATUS AND METHOD THEREOF Public/Granted day:2020-02-20
Information query
IPC分类:
