Invention Grant
- Patent Title: Fingerprint chip package and method for processing same
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Application No.: US16133668Application Date: 2018-09-17
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Publication No.: US10854536B2Publication Date: 2020-12-01
- Inventor: Shanshan Zeng , Penghui Wang , Junping Luo
- Applicant: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: J.C. Patents
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/31 ; H01L23/00 ; G06K9/00 ; H01L21/56 ; H01L21/66 ; H01L21/48

Abstract:
A fingerprint chip package and method for processing same, relating to a field of biometric identification. The fingerprint chip package includes: a lead frame (1), a chip (2), and a plastic packaging part enclosing the lead frame (1) and the chip (2); the lead frame (1) comprises a base island (13), a connecting rib (11), and a golden finger (12); the base island (13) is used for bearing the chip (2); the connecting rib (11) is used for supporting the lead frame (1) and connecting the base island (13) via the golden finger (12); and the golden finger (12) is used for fixing the base island (13) and electrically connecting with the chip (2).
Public/Granted literature
- US20190019744A1 FINGERPRINT CHIP PACKAGE AND METHOD FOR PROCESSING SAME Public/Granted day:2019-01-17
Information query
IPC分类: