Devices and methods are disclosed, related to shielding and packaging of radio-frequency (RF) devices on substrates. In some embodiments, a method for providing electro-magnetic interference shielding for a radio-frequency module can include applying a metal-based covering over a portion of a lead-frame package, the package having a plurality of pins with at least one pin exposed from overmold compound and in contact with the metal-based covering. The method can also include mounting the lead-frame package on a substrate. The method can further include connecting the metal-based covering to a ground plane of the substrate.