Invention Grant
- Patent Title: Method for manufacturing anisotropic conductive adhesive including gapper and method for mounting component using gapper
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Application No.: US16491893Application Date: 2018-04-26
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Publication No.: US10854572B2Publication Date: 2020-12-01
- Inventor: Kyung Sub Lee
- Applicant: NOPION.CO.LTD
- Applicant Address: KR Suwon-si
- Assignee: NOPION.CO.LTD
- Current Assignee: NOPION.CO.LTD
- Current Assignee Address: KR Suwon-si
- Agency: Novick, Kim & Lee, PLLC
- Agent Jae Youn Kim; Jihun Kim
- Priority: KR10-2017-0053765 20170426
- International Application: PCT/KR2018/004822 WO 20180426
- International Announcement: WO2018/199639 WO 20181101
- Main IPC: H01L23/00
- IPC: H01L23/00 ; C09J5/06 ; C09J9/02 ; C09J11/08
Abstract:
Provided relates to a method for manufacturing an anisotropic conductive adhesive and a method for mounting a component using an anisotropic conductive adhesive, and provides a method for manufacturing an anisotropic conductive adhesive, including: a process of removing a first oxide film on solder particles by using a first reducing agent; and a process of manufacturing an anisotropic conductive adhesive by mixing the solder particles, a gapper, and an adhesive resin.
Public/Granted literature
Information query
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