Invention Grant
- Patent Title: Light-emitting module
-
Application No.: US16011968Application Date: 2018-06-19
-
Publication No.: US10854582B2Publication Date: 2020-12-01
- Inventor: Keiichi Maki
- Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
- Applicant Address: JP Asahikawa
- Assignee: Toshiba Hokuto Electronics Corporation
- Current Assignee: Toshiba Hokuto Electronics Corporation
- Current Assignee Address: JP Asahikawa
- Agency: Burr & Brown, PLLC
- Priority: JP2015-257166 20151228; JP2016-062160 20160325
- Main IPC: H01L25/075
- IPC: H01L25/075 ; H05K1/11 ; H01L33/56 ; H05B33/06 ; H05K1/18 ; H05K1/14 ; H01L33/62

Abstract:
Disclosed is a light-emitting module including: a first insulation film having light transmissive property; a conductor layer provided on the first insulation film; a second insulation film disposed to face the first insulation film; a plurality of light-emitting elements interposed between the first insulation film and the second insulation film and have one surface on which a pair of electrodes connected to the conductor layer are provided; and a board that is connected to the first insulation film and has a circuit connected to the conductor layer.
Public/Granted literature
- US20180301437A1 LIGHT-EMITTING MODULE Public/Granted day:2018-10-18
Information query
IPC分类: