Invention Grant
- Patent Title: Linear image sensor and method for manufacturing same
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Application No.: US16322558Application Date: 2017-07-25
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Publication No.: US10854650B2Publication Date: 2020-12-01
- Inventor: Norihiro Muramatsu , Katsunori Nozawa
- Applicant: HAMAMATSU PHOTONICS K.K.
- Applicant Address: JP Hamamatsu
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu
- Agency: Faegre Drinker Biddle & Reath LLP
- Priority: JP2016-158527 20160812
- International Application: PCT/JP2017/026892 WO 20170725
- International Announcement: WO2018/030147 WO 20180215
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L27/146 ; H01L23/28 ; H04N1/028 ; H01L25/04
Abstract:
A linear image sensor includes first and second sensor chips, first and second substrates, a common support substrate, a support portion, a dam portion, and a sealing portion. The first sensor chip is mounted to partially protrude on one end side of the first substrate. The second sensor chip is mounted to partially protrude on one end side of the second substrate. The first and second substrates are mounted on the common support substrate. The support portion is provided in a gap between the end faces of the first and second substrates. The dam portion is provided annularly to surround the sensor chips. The sealing portion seals the sensor chips, in a region surrounded by the dam portion.
Public/Granted literature
- US10886316B2 Linear image sensor and method for manufacturing same Public/Granted day:2021-01-05
Information query
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