Invention Grant
- Patent Title: Solid-state imaging device, manufacturing method of solid-state imaging element, and imaging apparatus
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Application No.: US16430218Application Date: 2019-06-03
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Publication No.: US10854667B2Publication Date: 2020-12-01
- Inventor: Hiroyasu Matsugai
- Applicant: SONY CORPORATION
- Applicant Address: JP Toyko
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Toyko
- Agency: Sheridan Ross P.C.
- Priority: JP2014-121289 20140612
- Main IPC: H01L27/146
- IPC: H01L27/146
Abstract:
There is provided solid-state imaging devices and methods of forming the same, the solid-state imaging devices including: a semiconductor substrate; a glass substrate; an adhesion layer provided between the semiconductor substrate and the glass substrate; and a warpage correction film provided adjacent to one of the semiconductor substrate and the glass substrate.
Public/Granted literature
- US20190355780A1 SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD OF SOLID-STATE IMAGING ELEMENT, AND IMAGING APPARATUS Public/Granted day:2019-11-21
Information query
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