- Patent Title: Electronic component with a high-electron-mobility heterojunction
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Application No.: US16349899Application Date: 2017-11-08
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Publication No.: US10854722B2Publication Date: 2020-12-01
- Inventor: Erwan Morvan
- Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Applicant Address: FR Paris
- Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee Address: FR Paris
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR1661026 20161115
- International Application: PCT/FR2017/053048 WO 20171108
- International Announcement: WO2018/091799 WO 20180524
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/20 ; H01L29/205 ; H01L29/778 ; H01L29/872 ; H01L29/66 ; H01L29/786

Abstract:
The invention relates to an electronic component with a high-electron-mobility heterojunction. The component includes a superposition of a first semiconductor layer and of a second semiconductor layer, to form an electron-gas layer in proximity to the interface between the first and second semiconductor layers, and first and second conductive metal electrode contacts formed on said second semiconductor layer plumb with the electron-gas layer. At least one of the first and second metal contacts has a contact length L such that L≤1.5*√(ρc/R2 Deg), where ρc is the specific resistance of the metal contact with the electron-gas layer at 425 K and R2 Deg is the sheet resistance in the electron-gas layer at 425 K.
Public/Granted literature
- US20200066891A1 ELECTRONIC COMPONENT WITH A HIGH-ELECTRON-MOBILITY HETEROJUNCTION Public/Granted day:2020-02-27
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