Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16090885Application Date: 2017-03-22
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Publication No.: US10854762B2Publication Date: 2020-12-01
- Inventor: Kohei Ebihara , Masayuki Furuhashi , Takanori Tanaka
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Xsensus LLP
- Priority: JP2016-085004 20160421
- International Application: PCT/JP2017/011344 WO 20170322
- International Announcement: WO2017/183375 WO 20171026
- Main IPC: H01L29/872
- IPC: H01L29/872 ; H01L29/47 ; H01L29/12 ; H01L29/78 ; H01L21/28 ; H01L29/06 ; H01L29/16 ; H01L29/417

Abstract:
A semiconductor device includes an n-type drift layer formed on a semiconductor substrate having an off-angle, plurality of p-type pillar regions formed in the drift layer, and a surface electrode formed on the drift layer including the plurality of p-type pillar regions. A plurality of withstand voltage holding structures which are p-type semiconductor regions are formed in a surface layer of the drift layer including the plurality of p-type pillar regions to surround an active region. Each of the plurality of p-type pillar regions has a linear shape extending in a direction of the off-angle of the semiconductor substrate. Each of the plurality of withstand voltage holding structures has a frame-like shape including sides extending in parallel with the plurality of p-type pillar regions and sides perpendicular to the plurality of p-type pillar regions in a planar view.
Public/Granted literature
- US20190074386A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-03-07
Information query
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