Invention Grant
- Patent Title: Antenna package structure and antenna packaging method
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Application No.: US16353990Application Date: 2019-03-14
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Publication No.: US10854951B2Publication Date: 2020-12-01
- Inventor: Yenheng Chen , Chengchung Lin , Chengtar Wu , Jangshen Lin
- Applicant: SJ Semiconductor(Jiangyin) Corporation
- Applicant Address: CN JiangYin
- Assignee: SJ Semiconductor (Jiangyin) Corporation
- Current Assignee: SJ Semiconductor (Jiangyin) Corporation
- Current Assignee Address: CN JiangYin
- Agency: Alston & Bird LLP
- Priority: CN2018102175704 20180316; CN2018203593267U 20180316
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01Q1/22 ; H01Q21/00 ; H01Q9/04 ; H01Q21/06 ; H01L23/522 ; H01L23/00 ; H01L23/66
Abstract:
The present disclosure provides an antenna package structure and an antenna packaging method for a semiconductor chip. The package structure includes an antenna circuit chip, a first rewiring layer, an antenna structure, a second metal connecting column, a second packaging layer, a second antenna metal layer, and a second metal bump. The antenna circuit chip, the antenna structure, and the second antenna metal layer are interconnected by using two rewiring layers and two layers of metal connecting columns.
Public/Granted literature
- US20190288372A1 ANTENNA PACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD Public/Granted day:2019-09-19
Information query
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